Thermal Silicone Grease Compound Glue Heatsink
Stars-922 Heatsink Plaster which is high conductivity, low bleed, stable at high temperatures, viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels. Primary Use: Thermal coupling of nozzle for 3D printer or CPU.
Features
- Dissipation coefficient: <0.005
- Temperature resistance: 200 degree Celsius
- Silicone thermal compound
- Thermal Conductivity: >1.22W/m.k